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 BU900TP
NPN power TRILINTON
Preliminary Data
Features

Integrated high voltage active clamping zener Integrated antiparallel collector-emitter diode Clamping energy capability 100% tested Very high current gain
1 2 3
Applications

SOT-82
Engine ignition control Switching regulators Motor control Light ballast Figure 1. Internal schematic diagram
Description
The BU900TP is a planar, monolithic, high voltage power Trilinton with a built-in active zener clamping circuit and an antiparallel Collector to Emitter diode. This device has been specifically designed for unclamped, inductive applications such as Ignition systems, Switching Regulators, and wherever high voltage and high robustness is required.
Table 1.
Device summary
Marking BU900TP Package SOT-82 Packing Tube
Part Number BU900TP
August 2007
Rev 1
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www.st.com 8
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
Electrical ratings
BU900TP
1
Electrical ratings
Table 2.
Symbol
Absolute maximum rating
Parameter Value 370 8 5 8 1 55 -65 to 150 150 Unit V V A A A W C C
V(BR)CES Collector-emitter breakdown voltage (VBE = 0) VEBO IC ICM IB Ptot Tstg TJ Emitter-base voltage (IC = 0) Collector current Collector peak current (tP < 5ms) Base current Total dissipation at Tc = 25C Storage temperature Max. operating junction temperature
Table 3.
Symbol
Thermal data
Parameter Value 2.27 80 Unit C/W C/W
Rthj-case Thermal resistance junction-case Rthj-amb Thermal resistance junction-ambient
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BU900TP
Electrical characteristics
2
Electrical characteristics
(Tcase = 25C unless otherwise specified) Table 4.
Symbol IEBO ICES
Electrical characteristics
Parameter Emitter cut-off current (IC = 0) Collector cut-off current (VBE = 0) Collector-emitter breakdown voltage (VBE = 0) Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain Diode forward voltage Secondary breakdown energy Test Conditions VEB = 8 V VCE = 370 V Min. Typ. Max. 100 100 Unit A A
V(BR)CES
IC = 50 mA IC = 2.5 A IC = 3 A IC = 3 A IC = 1 A IC = 5 A IC = 4 A L = 10 mH __ _ _ _ IB = 1 mA IB = 3 mA IB = 3 mA
370
660
V
VCE(sat) (1) VBE(sat) (1) hFE VF Es/b (1)
4 4 3.5
V V V
VCE = 5 V 7000 18 80 V mJ
1. Pulsed duration = 300 ms, duty cycle 1.5%
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Electrical characteristics
BU900TP
2.1
Electrical characteristics (curves)
Figure 2. DC current gain Figure 3. Collector-emitter saturation voltage
Figure 4.
Collector-emitter saturation voltage
Figure 5.
Base-emitter saturation voltage
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BU900TP
Package mechanical data
3
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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Package mechanical data
BU900TP
SOT-82FM MECHANICAL DATA
mm MIN. A A1 b b1 b2 c D e E L L1 2.85 1.47 0.40 1.4 1.3 0.45 10.5 2.2 7.45 15.5 1.95 TYP. MAX. 3.05 1.67 0.60 1.6 1.5 0.6 10.9 2.8 7.75 15.9 2.35 MIN. 1.122 0.578 0.157 0.551 0.511 0.177 4.133 0.866 2.933 6.102 0.767 inch TYP. MAX. 1.200 0.657 0.236 0.630 0.590 0.236 4.291 1.102 3.051 6.260 0.925
DIM.
P032R
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BU900TP
Revision history
4
Revision history
Table 5.
Date 02-Aug-2007
Document revision history
Revision 1 First release. Changes
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BU900TP
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
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